DDI, which is the abbreviation of 'Display Driver IC' is the display driving chip which realizes the various colors by adjusting many pixels constituting the display. It converts the transmitted digital signal into RGB analogue value to realize the image in the smart phone, tablet PC and TV display panel.
CIS is the abbreviation of CMOS Image Sensor. This semiconductor device is designed to detect the light and convert it into the electric signal and then into the digital data, thus realizing the image.
PM-IC is the abbreviation of Power Management IC. It is the IC which adjusts the power and is mostly used in the mobile equipment or the equipment which should be operated by battery to extend the driving time for the equipment.
Rim cut is rim remove process of IGBT Taiko wafer, that after EDS and for next sawing process
After Probe test, pick up good die only And reconstruction to ring frame as wafer form for next process
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