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CIS Test

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CIS is the abbreviation of CMOS image sensor It is the image sensor which has the IC containing tens to millions of pixels which convert the light energy to electric signal. It is the semiconductor device which converts the original image which is visible such as human or stuff into the electric signal inside the image sensor. It is the core part of digital camera and cell phone camera.

CIS Test process to check whether the entire chip on the CMOS Image Sensor Wafer is correctly operated through O/S and Function check by using each IC exclusive tester. After the electrical test, defective chips (reject die) can be inked on the chip surface or provided as a test map, so that only the good chip (Good Die) can be assembled during the subsequent A’ssy process. ALT provides optimal testing services by building CIS exclusive facilities capable of high-speed image capture and max. 64 DUT parallel tests.

Probe Test Process

Store
  • Wafer (6”, 8”, 12”)

1

IQC
  • Image High & low Power Scope
  • Clean Room (10 Class)

2

Probe Test
  • Electrical Testing
  • Program Development

3

AVI
  • Auto Visual Inspection

4

Inking
  • Wafer Reject Dies Inking
  • Clean Bake Oven

5

QVI
  • Image High & low Power Scope
  • Sampling or All

6

Packing
  • Barcode Labeling
  • Packing Machine

7

QPI
  • Packing & Sheet Inspection

8

Ship
  • Out box Packing

9

Contact for
each field

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